Nail care system

ABSTRACT

A nail care system for buffing and polishing fingernails and toenails is disclosed. The system includes a nail care strip that includes a layer of a liquid silicone resin formulation and abrasive grains.

FIELD OF THE DISCLOSURE

This disclosure, in general, relates to a nail care system for buffingand polishing fingernails and toenails.

BACKGROUND

In caring for fingernails and toenails, natural and artificial nails arecleaned, filed, smoothed, and polished. Typical nail files are used tosmooth both the ends and the tops of the surface of fingernails andtoenails. Typically, nail files are long, stiff strips that have thetexture of sandpaper.

Commercially available nail files suffer from a number of drawbacks.After a few uses, the nail files tend to become visibly degraded,non-uniform, and soiled, presenting an unsightly appearance even thoughthe product may still have a significant number of uses remaining.Additionally, many nail files trap in nail particles and bacteria thatare filed from the surface of the fingernail and toenail. Accordingly,in spas and nail care facilities, nail files cannot be used by more thanone consumer due to the possibility of transferring bacteria and nailparticles to other consumers.

Moreover, many nail files are configured as a generally thick block thatis stiff such that it does not conform readily to nail surfaces. Due tothe thickness and stiffness of the nail files, attempts to smooth hardto reach areas, such as the contoured area between the skin and thefingernail, may result in excessive pressure applied to the surface ofthe nail and relatively little polishing of the region.

As such, an improved nail care system would be desirable.

SUMMARY

In a particular embodiment, a nail care system for buffing and polishingfingernails and toenails is disclosed. The system includes a nail carestrip including a layer of a liquid silicone resin formulation andabrasive grains.

In another embodiment, a method of buffing a fingernail and a toenail isprovided. The method includes cleaning the nail and buffing the nailwith a nail care strip. The nail care strip includes a layer of a liquidsilicone resin formulation and abrasive grains.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure may be better understood, and its numerousfeatures and advantages made apparent to those skilled in the art byreferencing the accompanying drawings.

FIG. 1 includes a diagram illustrating an exemplary nail care system.

FIG. 2 includes an illustration of a cross-sectional view of anexemplary structured nail care strip.

The use of the same reference symbols in different drawings indicatessimilar or identical items.

DESCRIPTION OF THE EMBODIMENTS

In the specification and in the claims, the terms “including” and“comprising” are open-ended terms and should be interpreted to mean“including, but not limited to . . . .” These terms encompass the morerestrictive terms “consisting essentially of” and “consisting of.”

A nail care system is provided that can be used to treat the surface ofa fingernail, toenail, or combination thereof. For instance, the nailcare system includes a nail care strip for sanding, cleaning, buffing,and polishing a fingernail and a toenail. In an exemplary embodiment,the nail care strip includes a layer of a liquid silicone resin andabrasive grains. The nail care strip is a reusable, flexible stripcapable of treating the top surface or end surface of the nail. “Nail”as used herein refers to the fingernail, the toenail, or combinationthereof.

In one exemplary embodiment, the nail care system 100 is a merchandisedarticle for commercial sale. FIG. 1 illustrates a nail care system 100including a nail care strip 102 and packaging 104. The packaging 104includes a holding compartment 106 for the nail care strip 102. Thepackaging 104 may include a sales message, title or description of thenail care strip 108 and a barcode 110 or other indicator of sales priceor facilitator of a sales transaction.

In addition, the nail care system 100 may include a set of printedinstructions 112. The printed instructions 112 may be printed on thepackaging 104 or included as a separate sheet with the packaging 104 andnail care strip 102. In one exemplary embodiment, the instructionsdirect a user to place the nail care strip 102 on a fingernail or atoenail surface. In another exemplary embodiment, the instructions 112direct a user to buff the fingernail and the toenail with the nail carestrip. In another exemplary embodiment, the instructions 112 direct auser to polish the fingernail and the toenail with the nail care strip.

The nail care strip is formed from an abrasive formulation forming alayer of surface features. In an embodiment, the nail care strip isbackless (i.e., free of a structural backing layer), such that the nailcare strip is self-supporting. Particularly, the formulation forming thelayer of surface features is self-supporting, such that the layerwithstands use without structural degradation before the abrasiveproperties are consumed. The abrasive feature layer includes an assemblyof surface protrusions. The assembly of surface protrusions may berandom, and in one embodiment, forms a pattern. In addition, thecross-section surface area may vary (generally, increase) during wear ofthe nail care strip, such as in the case of a sloping-sidewall surfaceprotrusion (pyramidal, conical, prismatic, etc. surface protrusions), ormay have generally constant cross-sectional surface area during wear,such as in the case of vertical-walled protrusions (rectangular, square,rod, etc. protrusions). In an exemplary embodiment, the nail care stripmay also include an adhesion layer.

In an exemplary embodiment, the nail care strip includes an abrasivefeature layer formed from a silicone resin and abrasive grains. Forexample, the silicone resin may be formed from a high consistencysilicone rubber (HCR) or a liquid silicone rubber (LSR). In anembodiment, the high consistency silicone rubber (HCR) or liquidsilicone rubber (LSR) can further include a reinforcing particulate. Ina particular example, the silicone resin is formed from an LSR. Ingeneral, the silicone rubber, such as the LSR or HCR, crosslinks to formthe silicone resin, which forms a matrix in which the abrasive grainsmay be distributed or dispersed. Such a crosslinked silicone resinserves as a binder for the abrasive grains and is to be contrasted withuncrosslinked silicones that are configured to migrate to the surface ofa nail care strip.

The silicone resin may also be formed from silicone oils, which aregenerally obtained free of fumed silica. In an exemplary embodiment, thesilicone oils, parts A and B, are blended with a catalyst, reinforcingparticulate, such as fumed silica, and abrasive grains, and subsequentlycured to form the silicone resin product. In a particular embodiment,the silicone resin is a liquid silicone rubber where parts A and B areblended with a catalyst, reinforcing particulate, such as fumed silica,and abrasive grains, and subsequently cured to form the silicone resinproduct.

An exemplary silicone oil or silicone rubber includes a siloxanepolymeric backbone to which functional groups may be attached. In anexample, a functional group may include an un-reactive functional groupsuch as a halogen group, a phenyl group, or an alkyl group, or anycombination thereof. For example, a fluorosilicone may include afluorine functional group attached to the backbone. In another exemplaryembodiment, the siloxane backbone may be attached to a methyl, an ethyl,a propyl group, or any combination thereof. In addition, the siloxanebackbone may include reactive functional groups that function toencourage crosslinking. An exemplary reactive functional group includesa hydride group, a hydroxyl group, a vinyl group, or any combinationthereof. For example, the siloxane polymer may include apolyfluorosiloxane, a polyphenylsiloxane, a polyalkylsiloxane, or anycombination thereof, which have a reactive functional group, such as avinyl termination. In a particular example, the silicone resin is formedfrom a base polysiloxane and a cross-linking agent. The basepolysiloxane may be a polyalkylsiloxane such as silicone polymers formedof a precursor, such as dimethylsiloxane, diethylsiloxane,dipropylsiloxane, methylethylsiloxane, methylpropylsiloxane, orcombinations thereof. In a particular embodiment, the polyalkylsiloxaneincludes a polydialkylsiloxane, such as polydimethylsiloxane (PDMS). Forinstance, the silicone resin is a liquid silicone rubber (LSR) whereinthe first part includes a vinyl terminated or grafted polyalkylsiloxane.

In an example, the silicone resin, such as the liquid silicone rubber,further includes a cross-linking agent. In an embodiment, thecross-linking agent may be an organic cross-linking agent. In aparticular example, the cross-linking agent is a silicone basedcross-linking agent including reactive hydride functional groups. Forinstance, the crosslinking agent may include a siloxane-basedcrosslinking agent, having a siloxane backbone attached to reactivefunctional groups, such as hydride or hydroxyl groups. In a particularembodiment, the crosslinking agent may be polyhydroalkylsiloxane. In anembodiment, the silicone resin is the liquid silicone rubber wherein thesecond part includes the crosslinking agent.

In a particular embodiment, the abrasive feature layer may be formedfrom an uncured formulation including a liquid silicone rubber (LSR).For example, the uncured liquid silicone rubber may have a viscosity notgreater than about 600,000 cps when measured using test method DIN 53019 at a shear rate of about 10s⁻¹ and a temperature of about 21° C. Forexample, the viscosity may be not greater than about 450,000 cps, suchas not greater than about 400,000 cps. Typically, the viscosity is atleast about 50,000 cps, such as at least about 100,000 cps. In a furtherexample, the viscosity of silicone oil absent reinforcing particulatemay be about 5 cps to about 165,000 cps.

In the case of cured formulations, various curing agents, catalysts, andthermal or photoinitiators and sensitizers may be added to the siliconeresin prior to curing. In one example, the formulation may be curedusing a peroxide catalyst. In another example, the formulation may becured using a platinum catalyst. In an embodiment, the catalyst may becombination of a peroxide catalyst and a platinum catalyst. In aparticular example, the first part of a liquid silicone rubber furtherincludes the catalyst and an inhibitor. For instance, the silicone resinincludes a platinum catalyzed two-part liquid silicone rubber (LSR)wherein part A includes a vinyl terminated or grafted polyalkylsiloxane, a catalyst and an inhibitor and part B includes a siliconebased cross-linking agent including reactive hydride functional groups.

A silicone matrix formed of the cured silicone resin may exhibitdesirable mechanical properties, such that a nail care strip formed fromsuch a silicone resin is self-supporting, enabling formation of abackless nail care strip. In particular, the silicone resin may be usedto form the nail care strip that withstands use without structuraldegradation before the abrasive properties are consumed. For example,the silicone matrix, absent the abrasive grains, may exhibit desirableelongation-at-break, tensile strength, or tensile modulus. For example,the silicone matrix, absent the abrasive grains, may exhibit anelongation-at break of at least about 50%, such as at least about 100%,at least about 200%, at least about 300%, at least about 350%, at leastabout 450%, or even at least about 500%, as determined using DIN 53 504S1. In an embodiment, absent abrasive grains, the silicone resin withthe reinforcing silica filler may have an elongation-at-break of atleast about 350%, such as at least about 450% or even, at least about500% as determined using DIN 53 504 S1. In another example, the curedsilicone resin absent the abrasive grains may have a tensile strength ofat least about 10 MPa.

The formulation further includes abrasive grains. In the case of curedformulations, the silicone resin may be blended with abrasive grainsprior to curing. Typically, the abrasive grains are blended to form ahomogeneous mixture of the abrasive grains throughout the siliconeresin. The abrasive grains may be formed of any one of or a combinationof abrasive grains, including silica, alumina (fused or sintered),zirconia, zirconia/alumina oxides, silicon carbide, garnet, diamond,cubic boron nitride, silicon nitride, ceria, titanium dioxide, titaniumdiboride, boron carbide, tin oxide, tungsten carbide, titanium carbide,iron oxide, chromia, flint, emery, or any combination thereof. Forexample, the abrasive grains may be selected from a group consisting ofsilica, alumina, zirconia, silicon carbide, silicon nitride, boronnitride, garnet, diamond, co-fused alumina zirconia, ceria, titaniumdiboride, boron carbide, flint, emery, alumina nitride, or a blendthereof. In particular, the abrasive grains may be selected from thegroup consisting of nitrides, oxides, carbides, or any combinationthereof. In an example, the nitride may be selected from the groupconsisting of cubic boron nitride, silicon nitride, or any combinationthereof. In another example, the oxide may be selected from the groupconsisting of silica, alumina, zirconia, zirconia/alumina oxides, ceria,titanium dioxide, tin oxide, iron oxide, chromia, or any combinationthereof. In a further example, the carbide may be selected from thegroup consisting of silicon carbide, boron carbide, tungsten carbide,titanium carbide, or any combination thereof, and in particular mayinclude silicone carbide. Particular embodiments use dense abrasivegrains comprised principally of alpha-alumina. In another particularexample, the abrasive grains include silicone carbide.

The abrasive grain may also have a particular shape. An example of sucha shape includes a rod, a triangle, a pyramid, a cone, a solid sphere, ahollow sphere, or the like. Alternatively, the abrasive grain may berandomly shaped.

The abrasive grains generally have an average grain size not greaterthan 2000 microns, such as not greater than about 1500 microns. Inanother example, the abrasive grain size is not greater than about 750microns, such as not greater than about 350 microns. For example, theabrasive grain size may be at least 0.1 microns, such as about 0.1microns to about 1500 microns, and more typically about 0.1 microns toabout 200 microns or about 1 micron to about 100 microns. The grain sizeof the abrasive grains is typically specified to be the longestdimension of the abrasive grain. Generally, there is a rangedistribution of grain sizes. In some instances, the grain sizedistribution is tightly controlled. In an embodiment, the abrasivegrains further include aggregates of the abrasive grains. Typically, thetype of abrasive grain and the size of the abrasive grain may be chosendepending upon the level of abrasion desired on the nail surface.

In an exemplary formulation, the abrasive grains provide about 10% toabout 90%, such as from about 30% to about 80%, of the total weight ofthe formulation. In an exemplary embodiment, the formulation includes atleast about 30 wt % of the abrasive grains based on the total weight ofthe formulation. For example, the formulation may include at least about45 wt % of the abrasive grains, such as at least about 55 wt % of theabrasive grains. In general, the formulation includes not greater than90 wt % of the abrasive grains, such as not greater than 85 wt % of theabrasive grains.

In an exemplary embodiment, the formulation forming the nail care stripmay include a reinforcing particulate. In the case of curedformulations, the optional reinforcing particulate is typically addedprior to curing. Typically, the reinforcing particulate is blended toform a homogeneous mixture of the reinforcing particulate throughout thesilicone resin. For example, the reinforcing particulate may beincorporated in the silicone resin. Alternatively, the reinforcingparticulate may be added to the silicone oil in conjunction withpreparing the formulation, such as just prior to adding the abrasivegrains. An exemplary reinforcing particulate includes a silicaparticulate, an alumina particulate, or any combination thereof. In aparticular example, the reinforcing particulate includes silica, such asfumed silica. An exemplary silica particulate is available from Degussaunder the trade name Aerosil, such as Aerosil R812S, or available fromCabot Corporation, such as Cabosil M5 fumed silica. In another exemplaryembodiment, the reinforcing silica may be incorporated into a liquidsilicone rubber formulation, such as Elastosil 3003 formulationsavailable from Wacker Silicones. In an embodiment, the reinforcingparticulate is typically dispersed within the silicone matrix, and istypically mono-dispersed, being substantially agglomerate free. Inanother embodiment, the reinforcing particulate is dispersed within thesilicone matrix as aggregates and agglomerates.

In another exemplary embodiment, reinforcing particulate formed viasolution-based processes, such as sol-formed and sol-gel formedceramics, are particularly well suited for use in the formulation.Suitable sols are commercially available. For example, colloidal silicasin aqueous solutions are commercially available under such tradedesignations as “LUDOX” (E.I. DuPont de Nemours and Co., Inc.Wilmington, Del.), “NYACOL” (Nyacol Co., Ashland, Ma.) or “NALCO” (NalcoChemical Co., Oak Brook, Ill.). Many commercially available sols arebasic, being stabilized by alkali, such as sodium hydroxide, potassiumhydroxide, or ammonium hydroxide. Additional examples of suitablecolloidal silicas are described in U.S. Pat. No. 5,126,394, incorporatedherein by reference. Especially well-suited are sol-formed silica andsol-formed alumina. The sols can be functionalized by reacting one ormore appropriate surface-treatment agents with the inorganic oxidesubstrate particles in the sol.

In a particular embodiment, the reinforcing particulate is sub-micronsized. The reinforcing particulate may have a surface area in a range ofabout 50 m²/g to about 500 m²/g, such as within a range of about 100m²/g to about 400 m²/g. The reinforcing particulate may be a nano-sizedparticulate, such as a particulate having an average particle size ofabout 3 nm to about 500 nm. In an exemplary embodiment, the reinforcingparticulate has an average particle size of about 3 nm to about 200 nm,such as about 3 nm to about 100 nm, about 3 nm to about 50 nm, about 8nm to about 30 nm, or about 10 nm to about 25 nm. In particularembodiments, the average particle size is not greater than about 500 nm,such as not greater than about 200 nm, or not greater than about 150 nm.For the reinforcing particulate, the average particle size may bedefined as the particle size corresponding to the peak volume fractionin a small-angle neutron scattering (SANS) distribution curve or theparticle size corresponding to 0.5 cumulative volume fraction of theSANS distribution curve.

The reinforcing particulate may also be characterized by a narrowdistribution curve having a half-width not greater than about 2.0 timesthe average particle size. For example, the half-width may be notgreater than about 1.5 or not greater than about 1.0. The half-width ofthe distribution is the width of the distribution curve at half itsmaximum height, such as half of the particle fraction at thedistribution curve peak. In a particular embodiment, the particle sizedistribution curve is mono-modal. In an alternative embodiment, theparticle size distribution is bi-modal or has more than one peak in theparticle size distribution.

In an example, the reinforcing particulate is included in theformulation in an amount based on the combined weight of the silicone,the reinforcing particulate, and the abrasive grains. For example, thereinforcing particulate may be included in the formulation in an amountof at least about 3 wt % based on the total weight of the formulation,including reinforcing particulate, silicone resin, and abrasive grains.In particular, the formulation may include at least about 5 wt % of thereinforcing particulate or particulate, such as at least about 10 wt %of the reinforcing particulate, or even at least about 13 wt % of thereinforcing particulate. Further, the formulation may include notgreater than about 60 wt % of the reinforcing particulate, such as notgreater than about 50 wt % of the reinforcing particulate.

Generally, the formulation, including the silicone resin, the abrasivegrains, and optional reinforcing particulate, forms the abrasive featurelayer of the nail care strip. The type of abrasive grains and anyoptional reinforcing particulate may be chosen depending upon the levelof abrasion desired on the nail surface. In some embodiments, the nailcare strip consists essentially of the liquid silicone rubber andabrasive grains described above. As used herein, the phrase “consistsessentially of” used in connection with the nail care strip precludesthe presence of polymers that affect the basic and novel characteristicsof the nail care strip, although, various curing agents, catalysts, andthermal or photoinitiators, sensitizers, and reinforcing particulatesmay be used in the nail care strip.

Once formed into a layer, the formulation exhibits mechanical propertiesthat advantageously enhance the performance of the nail care stripformed of the formulation. In particular, the formulation may exhibitdesirable mechanical properties, such as elongation-at-break, hardness,tensile modulus, or tensile strength. In addition, the nail care stripmay be evaluated for performance in producing surface characteristicsdesirable for the surface of the nail such as, for example, smoothness,polish, shine, and the like.

In an exemplary embodiment, the formulation exhibits anelongation-at-break of at least about 50%, for example, measured usingtest method ASTMD 412 or test method DIN 53 504 S 1. In particular, theelongation-at-break may be at least about 100%, such as at least about125%, or even at least about 135%.

The cured formulation may also have a desirable hardness, such as ahardness in a range of about 50 shore A to about 75 shore D based ontesting method DIN53 505. For example, the hardness may be not greaterthan about 75 shore D, such as not greater than about 60 shore D, or notgreater than about 50 shore D. The hardness of the cured formulationindicates a flexible material.

In another exemplary embodiment, the formulation exhibits a desirabletensile modulus of not greater than about 8.0 MPa at 100% strain basedon ASTM D 412. For example, the tensile modulus may be not greater thanabout 7.6 MPa, such as not greater than about 7.5 MPa. In addition, thecured formulation may have a desirable tensile strength of at leastabout 7.0 MPa based on ASTM D 412. For example, the cured formulationmay have a tensile strength of at least about 7.5 MPa, such as at leastabout 8.0 MPa. Alternatively, the formulation may exhibit a tensilemodulus of at least about 8 MPa, such as at least about 14 MPa, or evenat least about 30 MPa. Particular formulations may exhibit a tensilemodulus of greater than 100 MPa.

In an exemplary embodiment, the formulation forms the abrasive featurelayer of a nail care strip. FIG. 2 includes an illustration of anexemplary structured nail care strip 200. Alternatively, the formulationmay be used in forming other non-structured coated nail care strips orbonded nail care strips. Typically, a structured coated nail care stripincludes a coated nail care strip having an assembly of protrudingsurface structures, typically arranged in a pattern.

The structured nail care strip, also called an engineered abrasivearticle, contains a plurality of abrasive grains dispersed in a binderand formed into discrete three-dimensional units either in a pattern ora random array on or throughout the nail care strip. In an embodiment,these nail care strips are designed to wear away, continually exposingfresh abrasive to the grinding interface.

The exemplary nail care strip 200 illustrated in FIG. 2 includes anabrasive feature layer 202. The abrasive feature layer 202 includesprotruding structures 208, which may be arranged in a pattern. In theillustrated embodiment, the protruding structures 208 are configured toprovide increasing contact area in response to wear, as in the case ofprotrusions with sloping side surfaces. For example, the structures 208may have a cross-section that decreases with increased distance from thebase of the abrasive feature layer 202. Typically, the abrasive featurelayer 202 is formed from the formulation that includes the liquidsilicone rubber formulation, abrasive grains, and optional reinforcingparticulate. In particular, the abrasive grains are dispersed throughoutthe thickness of the abrasive feature layer 202 such that the abrasivefeature layer is self-sharpening. “Self-sharpening” as used hereinrefers to the abrasive feature layer 202 maintaining its abrasivequalities as the cleaning article is used and as the thickness of theabrasive feature layer 202 is decreased during wear. For example, theformulation may be formed into a patterned layer and cured or set toproduce the abrasive feature layer 202 having structures 208.

In an exemplary embodiment, the abrasive feature layer 202 may be formedwith a backing or support layer. The backing is typically directlybonded to and directly contacts the abrasive feature layer 202. Forexample, the abrasive feature layer 202 may be extruded onto orcalendered onto a backing. The backing or support may include a polymerfilm, a polymer foam, or a fibrous fabric. In a particular example, thebacking or support may include cloth, paper, or any combination thereof.Typically, the backing or support layer is a non-abrasive layer thatdoes not include abrasive grains. In an embodiment, the backing orsupport layer generally provides additional structural support orimparts mechanical properties to the nail care strip without which theabrasive feature layer 202 would not perform as well.

Alternatively, the nail care strip 200 may be free of a backing layer.Particular formulations used to form the abrasive feature layer 202provide desirable mechanical properties and can be self-supporting. Thatis, the abrasive feature layer 202 can be configured to not havereliance on a backing layer in use or during manufacture. For example, aself-supporting abrasive feature layer 202 may withstand use withoutstructural degradation prior to the abrasive properties being consumed.In particular, the properties of the polymer in the formulation maypermit formation of the nail care strip 200 without a backing layer,which may have particular advantages over the state of the art thatgenerally requires use of a backing to carry the abrasive layer throughthe coating process and to provide mechanical integrity or flexibilityduring use. In particular, the abrasive feature layer 202 may beself-supporting without the presence of an underlying support or backinglayer. Such underlying support or backing layers traditionally havetensile properties, such as a combination of strength and flexibility,that are superior to those of traditional abrasive layers. In thisparticular embodiment, the nail care strip 200 is free of a layer havingtensile properties superior to the tensile properties of the abrasivefeature layer 202.

In addition to the abrasive feature layer 202, the nail care strip 200may include an adhesion layer 204. In an embodiment, the adhesion layer204 may include a pressure sensitive adhesive or a cured adhesive. Whenthe adhesive is used to bond the nail care strip to a nail cleaningtool, a release film may cover the abrasive feature layer to preventpremature adhesion. Such release films are typically removed just priorto attachment of nail care strip 200 to the nail cleaning tool. In anembodiment, an adhesion layer may form an underside surface (not shown),such as a pressure sensitive adhesive surface, and the abrasive featurelayer may have surface features that form the abrasive upper surface. Ina particular embodiment, the adhesion layer is in direct contact, suchas without intervening structural layers, with the abrasive featurelayer.

In another exemplary embodiment, the adhesive layer 202 may bond to afastener sheet 206. For example, the fastener sheet 206 may be onecomponent of a hook and loop fastening system. Such a fastening systemmay be used to couple the nail care strip 200 to a nail cleaning tool.

The structures 208 of the nail care strip 200 may be arranged in apattern. For example, the abrasive structures may be arranged in a gridpattern. In another exemplary embodiment, abrasive structures may bearranged in parallel lines. Alternatively, the structures may bearranged randomly with no defined pattern, or elements may be offsetfrom one another in alternating rows or columns. In an additionalexample, the structures may be discrete protrusions having sloped sidewalls. In another example, the structures may be discrete protrusionshaving substantially vertical side walls. The structures may be arrangedin an array having a pattern or may be arranged in a random array.

In one embodiment, the abrasive structures protruding from the abrasivefeature layer are configured to increase in contact area in response towear. For example, the abrasive structure may have a triangularcross-section. With a first degree of wear, the contact area is lessthan the contact area resulting from additional wear. Typically withdecreasing vertical height, the contact area generally formed in ahorizontal plane increases. In another exemplary embodiment, thestructure may have a semicircular cross-section. The structures orprotrusions may have a vertical cross-section that is regularly shapedor irregularly shaped. If regularly shaped, the protrusions may have ahorizontal cross-section, such as a circle or a polygon.

Returning to FIG. 2, the formulation described above has been found tobe particularly useful in forming particular structured nail carestrips, especially those without a support or backing layer, andincluding thin structures. In an exemplary embodiment, the abrasivefeature layer 202 has a total height as denoted by letter “b” notgreater than about 500 mils, such as not greater than about 350 mils,not greater than about 200 mils, not greater than about 100 mils, notgreater than about 50 mils, or even not greater than about 35 mils. Theabrasive structures 208 as denoted by letter “a”, may be not greaterthan about 20 mils, such as not greater than about 15 mils. Further, thewidth of the abrasive feature layer 202 not including the abrasivestructures 208, as denoted by letter “c” may be not greater than about15 mils, such as not greater than about 10 mils.

The nail care strip 200 may be cut and shaped to any reasonable sizedepending on the use. For instance, the nail care strip may be shaped asa square, a rectangle, a circle, an oval, a triangle, a cylinder, or anyother reasonable shape. Further, the nail care strip may be shaped tofit a hand or any reasonable nail cleaning tool. In an embodiment, thenail care strip, tool, or combination thereof can be chosen to changethe abrasiveness as needed. In a particulate embodiment, the nail carestrip may be removed from the tool for cleaning, sanitization, orcombination thereof. Further, the nail care strip 200 has flexibility,which is desirable to clean the shape and contoured surfaces offingernails and toenail. For instance, the hardness of the cleaningarticle is in a range of about 50 shore A to about 75 shore D based ontesting method DIN53 505. For example, the hardness may be not greaterthan about 75 shore D, such as not greater than about 60 shore D, or notgreater than about 50 shore D.

In a particular embodiment, a method of buffing a fingernail or toenailis disclosed. An exemplary method of buffing a fingernail and a toenailis provided. In one particular embodiment, a nail care strip is used tofacilitate the buffing of a fingernail and a toenail. The methodincludes cleaning the nail. In an embodiment, the nail is cleaned by anyreasonable method envisioned. For instance, the nail is cleaned withwater such as tap water, distilled water, deionized water, andcombinations thereof. Further, any reasonable soap, detergent, solvent,cleanser, and the like may be used to remove any foreign matter such asdirt, grime, nail polish, nail debris, and the like that may be on thenail to provide a natural, clean nail surface. Typical solvents includeany reasonable nail polish remover. In an embodiment, the solventincludes a chemical cleanser. In an embodiment, the nail care strip isfree of any additional chemical cleansers. In a particular embodiment,the nail care strip may be used to clean the fingernail or toenail ofany nail debris and foreign matter.

The surface of the fingernail, toenail, or combination thereof is buffedwith the nail care strip. Buffing the surface includes abrading the nailsurface by wiping, scrubbing, and the like to provide a smooth nailsurface. In an embodiment, the fingernail or toenail may be buffed withor without a solvent. A typical solvent may aid in buffing the nailsurface. The solvent may be provided prior to buffing the fingernail ortoenail, during the abrading of the fingernail or toenail, or anycombination thereof. Solvents may include water such as tap water,distilled water, deionized water, and combinations thereof. Solvents mayfurther include any reasonable polishing agent such as waxes,lubricants, buffers, the like, and combinations thereof. For instance, apolishing agent powder is incorporated with the nail care strip. In anexemplary embodiment, the polishing agent powder reacts with water.

While embodiments of the nail care system are useful for naturally grownfingernails and toenails, other surfaces that may be cleaned include,for example, any artificial nail surface. In an exemplary embodiment,the artificial nail surface is clean of nail debris, foreign matter, andfree of any nail polish.

Particular embodiments of the nail care strip advantageously provideimproved surface characteristics when used. For example, use ofparticular embodiments of the nail care strip may exhibit improvementsin roughness and gloss in the fingernail and toenail. In an exemplaryembodiment, the nail care strip buffs the fingernail and toenail withoutleaving deep scratches or surface defects that remain on the fingernailand toenail surface. In a particular embodiment, such nail care stripsare useful in instances where no subsequent coating process is used andbuffing with the nail care strip may impart dirt or dust resistance tothe polished surface. In another embodiment, such nail care strips areuseful in instances where the nail is subsequently coated with anyreasonable nail polish.

Further, the nail care strip may be easily cleaned and reused. In aparticular embodiment, the nail care strip is cleaned of any remainingnail debris and foreign matter with water. In an exemplary embodiment,the nail care strip does not retain nail debris and foreign matterwithin its structure and thus, does not spread nail debris and foreignmatter to other surfaces. Further, the nail care strip is reusable, i.e.may be reused a multiple number of times without degrading and losingits efficiency as a nail care strip. For instance, the nail care stripcan be used at least about 3 to about 5 times, such as at least about 10times, or even at least about 20 times without visible degradation ofthe nail care strip. In an embodiment, any reasonable cleansing agentmay be used with the nail care strip to kill or remove any germs,bacteria, and the like. Exemplary cleansing agents include an alcohol,an antibacterial agent, and the like. For instance, a cleansing agentmay be added to the nail care strip by any reasonable method to kill orremove any germs, bacteria, and the like. In an embodiment, the nailcare strip is soaked in the cleansing agent to kill or remove any germs,bacteria, and the like.

Further details of the construction of the nail care strip may be foundin US Patent Application Publication No. US 2008/0014840A1 (US '840),incorporated herein by reference. It is noted that the US '840 isgenerally directed to abrasive structures utilized in the context ofautomotive paint repair, not in the context of nail care strips, andmethods of buffing a fingernail and toenail incorporating same.

The above-disclosed subject matter is to be considered illustrative, andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments, which fall withinthe true scope of the present invention. Thus, to the maximum extentallowed by law, the scope of the present invention is to be determinedby the broadest permissible interpretation of the following claims andtheir equivalents, and shall not be restricted or limited by theforegoing detailed description.

1. A nail care system for buffing and polishing fingernails andtoenails, the system comprising a nail care strip comprising a layer ofa liquid silicone resin formulation and abrasive grains.
 2. The nailcare system of claim 1, further including a package having a holdingcompartment for the nail care strip, the packaging providing a salemessage associated with the abrasive strip.
 3. (canceled)
 4. (canceled)5. (canceled)
 6. The nail care system of claim 1, wherein the liquidsilicone resin is formed of a two-part silicone rubber, wherein one partincludes a crosslinking agent.
 7. The nail care system of claim 1,wherein the nail care strip includes at least about 30 wt % of theabrasive grains based on the total weight of the formulation.
 8. Thenail care system of claim 1, wherein the abrasive grains are selectedfrom a group consisting of nitrides, carbides, oxides, and a blendthereof.
 9. The nail care system of claim 1, wherein the abrasive grainsis selected from a group consisting of silica, alumina, zirconia,zirconia/alumina oxides, silicon carbide, garnet, diamond, cubic boronnitride, silicon nitride, ceria, titanium dioxide, titanium diboride,boron carbide, tin oxide, tungsten carbide, titanium carbide, ironoxide, chromia, flint, emery, and any combination thereof.
 10. The nailcare system of claim 1, wherein the abrasive grains are in the form ofaggregates.
 11. The nail care system of claim 1, wherein the nail carestrip further includes a reinforcing particulate.
 12. (canceled)
 13. Thenail care system of claim 11, wherein the reinforcing particulateincludes silica.
 14. The nail care system of claim 1, wherein the nailcare strip is in the form of an abrasive sheet and wherein the nail carestrip is free of a backing layer.
 15. The nail care system of claim 1,wherein the nail care strip is in the form of a sheet having a majorsurface, wherein the major surface has an assembly of surfaceprotrusions.
 16. The nail care system of claim 15, wherein the assemblyof surface protrusions is arranged in a pattern.
 17. The nail caresystem of claim 15, wherein the surface protrusions are slopingside-wall surface protrusions.
 18. The nail care system of claim 15,wherein the surface protrusions are vertical walled surface protrusions.19. The nail care system of claim 1, wherein the nail care strip furtherincludes a polishing agent.
 20. (canceled)
 21. (canceled)
 22. A methodof buffing a fingernail and toenail, the method comprising: cleaning thefingernail, toenail, or combination thereof; and buffing the fingernail,toenail, or combination thereof with a nail care strip comprising alayer of a liquid silicone resin formulation and abrasive grains. 23.The method of claim 22, wherein the liquid silicone resin is formed of atwo-part silicone rubber, wherein one part includes a crosslinkingagent.
 24. The method of claim 22, wherein the nail care strip includesat least about 30 wt % of the abrasive grains based on the total weightof the formulation.
 25. The method of claim 22, wherein the abrasivegrains is selected from a group consisting of nitrides, carbides,oxides, and a blend thereof.
 26. (canceled)
 27. (canceled) 28.(canceled)
 29. (canceled)
 30. (canceled)
 31. (canceled)
 32. (canceled)33. The method of claim 22, wherein the abrasive grains is selected froma group consisting of silica, alumina, zirconia, zirconia/aluminaoxides, silicon carbide, garnet, diamond, cubic boron nitride, siliconnitride, ceria, titanium dioxide, titanium diboride, boron carbide, tinoxide, tungsten carbide, titanium carbide, iron oxide, chromia, flint,emery, and any combination thereof.
 34. (canceled)
 35. The method ofclaim 22, wherein the nail care strip further includes a reinforcingparticulate.
 36. (canceled)
 37. The method of claim 35, wherein thereinforcing particulate includes silica.
 38. (canceled)
 39. (canceled)40. (canceled)
 41. The method of claim 22, wherein the nail care stripincludes a major surface having a set of protrusions.
 42. (canceled) 43.(canceled)
 44. (canceled)
 45. (canceled)
 46. The method of claim 22,further comprising providing a solvent to the nail prior to buffing,during buffing, or combination thereof.
 47. (canceled)
 48. The method ofclaim 22, further comprising adding a cleansing agent to the nail carestrip to remove any germs from the nail care strip.